Electronic Modules

Technological limit is our challenge

Through the use of a host of different manufacturing technologies we are able to meet the diverse requirements of your components. All our processes are qualified and meet the requirements of the standards ISO9001:2000, ISO/TS 16949 (QS 9000, VDA 6.1) and ISO 13485:2003.

Features:

Processing all forms of fine-pitch housings such as: BGA, µBGA, CSP, quad flat pack etc (The assembly process for chip sizes of up to 0201 is qualified at Asetronics)

LCD bonding technology (e.g. heat seal and COB technology)

AOI (Automatic Optical Inspection), flying probe test, in-circuit test, boundary scan test, function test, firmware programming

Customer-specific configuration and packing of components